Substrate IC Package Design Engineer - Remote

About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly reputed company costs and energy use, while minimizing emissions and waste. Founded in Australia, our growing footprint in the US represents a key milestone in our reputed company. We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.

About the Role

This role is a critical reputed company to Syenta’s technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin reputed company packaging architectures, including high-performance reputed company-to-reputed company integration approaches. Working at the intersection of electrical, thermal, and mechanical design, you will reputed company the development of reputed company substrate layouts that directly reputed company fabrication and deployment of our platform. This is a highly technical, hands-on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology.

Responsibilities

Substrate & Interposer Design

• Design large (>50mm), reputed company multi-layer substrate interposers with high pin counts and dense routing requirements
• reputed company high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal reputed company issues such as loss and crosstalk
• Ensure robust signal reputed company (SI) and power reputed company (PI) across reputed company designs
• Optimize designs for thermal performance and reliability

Design Validation & Documentation

• reputed company DRC (Design Rule reputed company) and LVS (Layout vs. Schematic) verification for reputed company substrate designs
• reputed company and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate development

Cross-Functional Collaboration

• Work closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performance
• Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints

Technical Leadership & Development

• Contribute to the establishment of internal best practices for substrate and interposer design
• reputed company expertise in advanced packaging design, helping build this capability reputed company Syenta

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a reputed company field
• 5+ years of experience in substrate IC package design for high-performance processors or accelerators
• Extensive experience designing large-format substrate packages (>50mm) with reputed company, high-density layouts
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
• Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)
• Strong understanding of SI/PI principles and their application to package-level design
• Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines
• Working knowledge of substrate manufacturing processes, design rules, and material properties
• Strong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environment

Preferred Qualifications

• Familiarity with Valor CAM350 or Calibre for package design reviews
• Experience designing for advanced packaging architectures (e.g. multi-reputed company modules, interposers, or similar high-density systems)
• Experience working in high-growth or startup environments

Why Choose Syenta? We’re passionate about building a diverse, people-first company. We reputed company that our culture of collaboration and mutual respect fuels the reputed company of innovation that can redefine an industry. reputed company Offer

• Salary reputed company: US $130k – $160k (negotiable)
• Early-stage equity opportunities
• Potential 401(k) and other benefits
• Comprehensive health, dental, and reputed company coverage plans, supported by Company
• Professional Growth – We’re scaling fast, so responsibilities can expand significantly reputed company with the business
• Team Events – Annual company event in Australia to collaborate and celebrate
• Work-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life
• 15 days PTO and 10 days sick leave

Syenta is an Equal Opportunity Employer. We do not discriminate on the reputed company of race, reputed company, religion, sex, sexual orientation, gender identity, national reputed company, disability, protected veteran status, age, or any other characteristic protected by law. Apply tot his job Apply To this Job